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Gold coated silicon wafer_Molecular_structure_CAS_)
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Gold coated silicon wafer

Catalog No. 643262 Name Sigma Aldrich
CAS Number Website http://www.sigmaaldrich.com
M. F. Au Telephone 1-800-521-8956
M. W. 196.96655 Fax
Purity 99.99% (Ti) Email
Storage Chembase ID: 104020

SYNONYMS

Title
镀金硅片
IUPAC name
gold
IUPAC Traditional name
gold

DATABASE IDS

MDL Number MFCD00003436

PROPERTIES

Diam. × Thickness 4 in. × 500 μm
Layer Thickness 1000 Å
Linear Formula Au
Matrix Attachment Titanium, as adhesion layer used to bind the gold to the borosilicate glass cover slip
Purity 99.99% (Ti)
Purity 99.999% (Au)
MSDS Link Download
German water hazard class 3

DETAILS

Description (English)
General description
Titanium adhesion layer used to bind the gold to a silicon wafer <100>. Gold orientation is nominally highly polycrystalline with a preference to <111> orientation.1
Packaging
1 ea in padded box
Packaging 1 set in single wafer shipper
Description (简体中文)
General description
钛粘附层,用于将金粘合到硅片 (100) 上。金取向名义上为具有 <111> 取向的高度多晶的。1
包装
1 ea in padded box
Packaging 1 set in single wafer shipper

REFERENCES